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Silicon Wafers & Semiconductor Materials

Provides prime silicon wafers, SOI, epitaxial layers, dicing tapes, and specialty wafers (SiC, GaAs). High quality, short lead-times, and global logistics from Tokyo to worldwide markets.

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Our journey

Growth & Gratitude Since 2008

Our partner was founded in Fussa, Tokyo (2008.4) and expanded to Kabe in 2012, later Nishitama (2019). With over 80 employees and annual turnover exceeding 2 trillion JPY (~14 million USD), we specialize in semiconductor materials. Our principle: Growth and Gratitude. We prioritize customer needs with gratitude, delivering high-quality products and short delivery periods.

2008 Founded in Fussa
2012 Relocated to Kabe + warehouse
2019 Nishitama HQ
2025 Global supply network
Semiconductor Manufacturing Facility
Advanced Substrates

SOI, Epitaxial Wafers & Thin Films

High-performance engineered wafers for MEMS, power devices, RF and photonics.

SOI, Epitaxial Wafers & Thin Films Solutions

SOI (Silicon on Insulator)

Buried oxide layer for reduced parasitic capacitance, ideal for high-speed and low-power applications.

EPI Wafer (Epitaxial)

Single-crystal silicon deposition for precise doping and thickness control.

Insulating Films

SiO₂, LP-TEOS, P-SiO₂, LP-SiN, Poly-Si, RTO, and more.

Metal Films

W, EPI, AlSi, Cu, GaAs, Al-Cu, GaN, Ti, TiN, etc.

Available film types: Insulating films (SiO₂, LP-TEOS, P-SiO₂, LP-SiN, Poly-Si, RTO) & Metal films (W, Epi, AlSi, Cu, GaAs, Al-Cu, GaN, Ti, TiN, and custom stacks).
Complete Solutions

Special Wafers & Processing Services

Beyond standard silicon — compound semiconductors, wafer thinning, dicing, bonding and more.

SiC (Silicon Carbide)

High thermal conductivity for power electronics.

Sapphire / Glass / Silica

Optical & LED substrates.

III-V Compound (GaAs, InP)

RF, photonics, high-speed devices.

Wafer Processing

Thinning, dicing, bonding, patterned wafers.

Wafer Cassettes & Rings

FOUP, FOSB, wafer shipping boxes, dicing frames.

Bonded Wafers / Patterned

Custom designs for MEMS and advanced packaging.

Advanced Wafers & Processing Solutions
Wafer Processing Tapes

Dicing & Backgrinding Tapes

High-performance UV and Non-UV tapes engineered for dicing, backgrinding, and wafer handling.

Wafer Processing Tapes Solutions

UV Release Tapes

High adhesion under UV light, easy release after exposure. Ideal for thin wafer dicing.

  • Evenly distributed elasticity
  • Lower edge breaking probability
  • High heat tolerance
  • Strong adhesive properties

Non-UV Tapes

Less viscosity, safe peel-off using proper procedure. Anti-static, water resistant, and chemical resistant.

  • High adherence prevents soaking
  • Prevents contamination
  • Reduced warping for ultra-thin grinding
  • Acid/chemical resistant
Customizable tape specifications: We provide UV tape and Non-UV tape, and can adjust viscosity, thickness, and develop new tape types based on customer request.
Primary Products Applications

Silicon Wafers – Prime, Test, Mechanical & Dummy

High-grade silicon wafers for semiconductor fabrication, R&D, and industrial processes. Available in various diameters and specifications.

Prime Wafers

Highest quality epitaxy-ready, particle-free, for advanced nodes.

Test / Monitor Wafers

Cost-effective for process control, equipment qualification.

Mechanical & Dummy

Carrier wafers, thermal oxide, handling substrates.

Coin-roll / Partial Wafers

Small quantity / custom shapes for R&D and prototyping.

Evenly distributed elasticity
High tolerance to heat
Antistatic properties
Water & acid resistant
Reduced chipping & warping

Need Silicon Wafers or Specialty Substrates?

Request a quote for prime wafers, SOI, epi, SiC, GaAs, or custom dicing tapes. Shorter lead-times and global shipping.

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